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          SMT pick and place machine application

          222 Published by Elissa 11 21,2019

          Typical case of smt pick and place machine application.

          With the development of the SMT industry, the application of the smt pick and place machine has also been continuously developed. Automatic pick and place machine, high-speed pick and place machine began to occupy the new smt machine market.

          High-speed placement machine: The automatic pick and place machine is a device for automatically and accurately placing components at high speed and high precision. It is the most critical and complicated equipment in the whole SMT production. The smt pick and place machine is the main equipment in the SMT production line. It has evolved from an early low-speed mechanical machine to a high-speed optical centering machine, and has evolved into a modular and flexible connection.

          smt pick and place
          So smt pick and place machine is widely used in various industries, how smt pick and place machine is applied to the production? I will anaylze from the following aspect.

          1. Detection content:

          photo chip, identify wafer position and angle;

          2. Work requirements: provide the position and angle of the wafer on the tape, correct the wafer angle by the motor, and then pick up the specified position on the pcb

          System description, the whole system is controlled by industrial computer. The core structure is visual plus motion. The machine consists of two parts: one part is the feeding table, and the table has two racks placed in parallel. The machine picks up the place. And then the wafer is calibrated and the other part is a discharge table. After the machine takes the material and calibrates it, the material is sent to the table.

          smt pick and place

          3. The general working steps of the machine are as follows:
          a. First move to the component station;
          b. Take a picture and calculate the position of the wafer;
          c. Perform rotation correction according to the angle of the wafer;
          d. Calculate the precise target position based on the position of the wafer and move it past;
          e. After the position is in place, drive the suction needle down until the wafer is attached to the target position;
          f.? Return to the component position after pressing;
          g. back to the first step, then repeating.

          This is the application of smt pick and place machine

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